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DATA SHEET
MOS INTEGRATED CIRCUIT
PD3794
2700 PIXELS x 3 COLOR CCD LINEAR IMAGE SENSOR
The PD3794 is a color CCD (Charge Coupled Device) linear image sensor which changes optical images to electrical signal and has the function of color separation. The PD3794 has 3 rows of 2700 pixels, and each row has a single-sided readout type of charge transfer register. And it has reset feed-through level clamp circuits, a clamp pulse generation circuit, an RGB selector and voltage amplifiers. Therefore, it is suitable for 300 dpi/A4 color image scanners, color facsimiles and so on.
FEATURES
* Valid photocell * Line spacing * Color filter * Resolution : 2700 pixels x 3 : 32 m (4 lines) Green line-Blue line, Blue line-Red line : Primary colors (red, green and blue), pigment filter (with light resistance 107 lx*hour) : 12 dot/mm A4 (210 x 297 mm) size (shorter side) 300 dpi US letter (8.5" x 11") size (shorter side) * Drive clock level : CMOS output under 5 V operation * Data rate * Power supply * On-chip circuits : 4 MHz MAX. : +12 V : Reset feed-through level clamp circuits Clamp pulse generation circuit RGB selector Voltage amplifiers
* Photocell's pitch : 8 m
ORDERING INFORMATION
Part Number Package CCD linear image sensor 22-pin plastic DIP (400 mil)
PD3794CY
The information in this document is subject to change without notice. Document No.S13125EJ1V0DS00(1st edition) Date published December 1997 N CP(K) Printed in Japan
(c)
1997
PD3794
BLOCK DIAGRAM
1
14
SEL1 SEL2 22 20
VOD 19
GND 2
GND 11
GND 15
S2699
******
Photocell (Green)
S2700
D15
D64
D65
D66
D67
S1
S2
Transfer gate CCD analog shift register
S2699 S2700
13
TG1 (Green)
******
Photocell (Blue)
D15
D64
D65
D66
D67
S1
S2
Transfer gate VOUT 1 CCD analog shift register
S2699 S2700
12
TG2 (Blue)
******
Photocell (Red)
D15
D64
D65
D66
D67
S1
S2
Transfer gate CCD analog shift register Clamp pulse generator
10
TG3 (Red)
3
9
RB
2
2
PD3794
PIN CONFIGURATION (Top View) CCD linear image sensor 22-pin plastic DIP (400 mil)
Output signal
VOUT
1
22
SEL1
RGB select input 1
Ground
GND
2
21
NC
No connection
1
1
Reset gate clock
RB
1
3
20
SEL2
RGB select input2
No connection
NC
4
19
VOD
Output drain voltage
No connection
NC
5
18
NC
No connection
Blue
Red
No connection
NC
6
Green
17
NC
No connection
No connection
NC
7
16
NC
No connection
No connection
NC
8
15
GND
Ground
Shift register clock 2
2
9
14
1
Shift register clock 1
2700
2700
2700
Transfer gate clock 3 (for Red) Ground
TG3
10
13
TG1
Transfer gate clock 1 (for Green) Transfer gate clock 2 (for Blue)
GND
11
12
TG2
PHOTOCELL STRUCTURE DIAGRAM
PHOTOCELL ARRAY STRUCTURE DIAGRAM (Line spacing)
8 m
Green photocell array 4 lines (32 m)
5 m
3 m
8 m
8 m
Blue photocell array 4 lines (32 m)
Channel stopper
8 m
Red photocell array
Aluminum shield
3
PD3794
ABSOLUTE MAXIMUM RATINGS (TA = +25 C)
Parameter Output drain voltage Shift register clock voltage Reset gate clock voltage Transfer gate clock voltage RGB select input voltage Operating ambient temperature Storage temperature VOD V1, V2 VRB VTG1 to VTG3 VSEL1,VSEL2 TA Tstg Symbol Ratings -0.3 to +15 -0.3 to +8 -0.3 to +8 -0.3 to +8 -0.3 to +8 -25 to +60 -40 to +70 Unit V V V V V C C
Caution
Exposure to ABSOLUTE MAXIMUM RATINGS for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently.
RECOMMENDED OPERATING CONDITIONS (TA = +25 C)
Parameter Output drain voltage Shift register clock high level Shift register clock low level Reset gate clock high level Reset gate clock low level Transfer gate clock high level Transfer gate clock low level RGB select input high level RGB select input low level Data rate VOD V1H, V2H V1L, V2L VRBH VRBL VTG1H to VTG3H VTG1L to VTG3L VSEL1H, VSEL2H VSEL1L, VSEL2L fRB Symbol MIN. 11.4 4.5 -0.3 4.5 -0.3 4.5 -0.3 4.5 -0.3 - TYP. 12.0 5.0 0 5.0 0 V1HNote 0 5.0 0 1.0 MAX. 12.6 5.5 +0.5 5.5 +0.5 V1HNote +0.5 5.5 +0.5 4.0 Unit V V V V V V V V V MHz
Note
When Transfer gate clock high level (VTG1H to VTG3H) is higher than Shift register clock high level (V1H), Image lag can increase.
4
PD3794
ELECTRICAL CHARACTERISTICS
TA = +25 C, VOD = 12 V, data rate (fRB) = 1 MHz, storage time = 10 ms, light source: 3200 K halogen lamp +C-500S (infrared cut filter, t = 1mm), input signal clock = 5 Vp-p
Parameter Saturation voltage Saturation exposure Red Green Blue Photo response non-uniformity Average dark signal Dark signal non-uniformity Power consumption Output impedance Response Red Green Blue Image lag Offset level Note1 Output fall delay time Note2 Total transfer efficiency
Symbol Vsat SER SEG SEB PRNU ADS DSNU PW ZO RR RG RB IL VOS td TTE
Test Conditions
MIN. 2.0
TYP. 3.0 0.205 0.225 0.375
MAX.
Unit V lx*s lx*s lx*s
VOUT = 1.0 V Light shielding Light shielding
6 0.5 4.0 300 0.5 10.3 9.4 5.6 14.6 13.3 8.0 5.0 4.5 6.0 70 92 98
20 5.0 10.0 600 1 18.9 17.2 10.4 10.0 7.5
% mV mV mW k V/lx*s V/lx*s V/lx*s % V ns %
VOUT = 1.0 V
VOUT = 1.0 V VOUT = 1.0 V, data rate = 4 MHz
Response peak
Red Green Blue
630 540 460 DR1 DR2 Vsat /DSNU Vsat / Light shielding Light shielding -1000 - 750 3000 -300 1.0 +500 -
nm nm nm times times mV mV
Dynamic range
Reset feed-through noise Note1 Random noise
RFTN
Notes 1. Refer to TIMING CHART 2. 2. When the fall time of 1 (t1) is the TYP. value (refer to TIMING CHART 2).
5
PD3794
INPUT PIN CAPACITANCE (TA = +25 C, VOD = 12 V)
Parameter Shift register clock pin capacitance 1 Shift register clock pin capacitance 2 Reset gate clock pin capacitance Transfer gate clock pin capacitance Symbol C1 C2 CRB CTG Pin name Pin No. 14 9 3 13 12 10 22 20 MIN. TYP. 300 300 20 50 50 50 50 50 MAX. Unit pF pF pF pF pF pF pF pF
1 2 RB TG1 TG2 TG3
RGB select input pin capacitance
CSEL
SEL1 SEL2
RGB SELECT FUNCTION
RGB select input Output color SEL1 High level High level Low level Low level SEL2 High level Low level High level Low level Blue Green Red Prohibited
6
TIMING CHART 1-1
SEL1
SEL2
TG1 to TG3 1
a
b
2
RB
2763 2764 2765 2766 2767 2768 2769
Note Note
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
VOUT (Blue)
Optical black (48 pixels)
61 62 63 64 65 66
Invalid photocell (2 pixels)
Valid photocell (2700 pixels)
Invalid photocell (3 pixels)
Note Input the RB pluse continuously during this period, too.
PD3794
7
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
VOUT (Green)
Optical black (48 pixels)
Valid photocell (2700 pixels)
Invalid photocell (2 pixels)
Note Input the RB pluse continuously during this period, too.
2763 2764 2765 2766 2767 2768 2769
61 62 63 64 65 66
8
TIMING CHART 1-2
SEL1 SEL2
TG1 to TG3 1
b
c
2
RB
Note Note
Invalid photocell (3 pixels)
PD3794
TIMING CHART 1-3
SEL1
SEL2
TG1 to TG3 1
c
a
2
RB
2763 2764 2765 2766 2767 2768 2769
Note Note
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
VOUT (Red)
Optical black (48 pixels)
61 62 63 64 65 66
Invalid photocell (2 pixels)
Valid photocell (2700 pixels)
Invalid photocell (3 pixels)
PD3794
Note Input the RB pluse continuously during this period, too.
9
PD3794
TIMING CHART 2 (for each color)
t1 90 % 10 % t2
1
2
90 % 10 % t5 90 % 10 % + td RFTN t3 t6 t4
RB
VOUT 10 %
_
RFTN VOS
TG1 to TG3, 1, 2 TIMING CHART
t8 90 % t7 t9
TG1 to TG3
10 % t10 90 % t11
1
2
Symbol t1, t2 t3 t4 t5, t6 t7 t8, t9 t10, t11
MIN. 0 30 150 0 3000 0 900
TYP. 25 50 250 25 10000 50 1000
MAX.
Unit ns ns ns ns ns ns ns
1, 2 cross points
1
2 V or more
2
2 V or more
10
Remark
Adjust cross points of 1 and 2 with input resistance of each pin.
PD3794
APPLICATION TIMING EXAMPLE (for reference)
The PD3794 can be operated under the following timing to switch Red, Green, and Blue outputs and get each color data in a 1-pixel period. However the offset level of each color is not the same. Therefore, offset level compensation is required to each color by using each color's data at dark or the optical black pixels. The following timing and parameters are for reference only.
SEL1
SEL2
tR
tG
tB
1
2
RB
at dark
VOUT
with light
Red
Green
Blue
Symbol tR, tG, tB
MIN. 300
TYP. -
MAX.
Unit ns
11
PD3794
DEFINITIONS OF CHARACTERISTIC ITEMS
1. Saturation voltage: Vsat Output signal voltage at which the response linearity is lost. 2. Saturation exposure: SE Product of intensity of illumination (IX) and storage time (s) when saturation of output voltage occurs. 3. Photo response non-uniformity: PRNU The output signal non-uniformity of all the valid pixels when the photosensitive surface is applied with the light of uniform illumination. This is calculated by the following formula.
PRNU (%) = x x 100 x x : maximum of xj - x
2700 j=1
xj
2700
x=
xj : Output voltage of valid pixel number j
VOUT
Register Dark DC level
x x
4.
Average dark signal: ADS Average output signal voltage of all the valid pixels at light shielding. This is calculated by the following formula.
2700 j=1
dj
2700 dj : Dark signal of valid pixel number j
ADS (mV) =
5.
Dark signal non-uniformity: DSNU Absolute maximum of the difference between ADS and voltage of the highest or lowest output pixel of all the valid pixels at light shielding. This is calculated by the following formula.
DSNU (mV) : maximum of dj - ADS j = 1 to 2700 dj : Dark signal of valid pixel number j
VOUT ADS Register Dark DC level DSNU
12
PD3794
6. Output impedance: ZO Impedance of the output pins viewed from outside. 7. Response: R Output voltage divided by exposure (Ix*s). Note that the response varies with a light source (spectral characteristic). 8. Image Lag: IL The rate between the last output voltage and the next one after read out the data of a line.
TG
Light
ON
OFF
VOUT V1 VOUT
V1 IL (%) = VOUT
x100
9.
Random noise: Random noise is defined as the standard deviation of a valid pixel output signal with 100 times (=100 lines) data sampling at dark (light shielding).
100
(mV) =
(Vi - V) i=1
100
2
, V=
1
100
100 i=1
Vi
Vi: A valid pixel output signal among all of the valid pixels for each color
VOUT
V1 V2
...
line 1 line 2
...
V100
line 100
This is measured by the DC level sampling of only the signal level, not by CDS (Correlated Double Sampling).
13
PD3794
STANDARD CHARACTERISTIC CURVES
DARK OUTPUT TEMPERATURE CHARACTERISTIC 8 2
STORAGE TIME OUTPUT VOLTAGE CHARACTERISTIC (TA = +25 C)
4 Relative Output Voltage Relative Output Voltage 10 20 30 40 50 1
2
1
0.5
0.25
0.2
0.1 0
0.1
1
5 Storage Time (ms)
10
Operating Ambient Temperature TA(C)
TOTAL SPECTRAL RESPONSE CHARACTERISTICS (without infrared cut filter) (TA = +25 C) 100 R
B 80
G
Response Ratio (%)
60
40
G 20
B 0 400 500 600 Wavelength (nm) 700 800
14
PD3794
APPLICATION CIRCUIT EXAMPLE
+5 V 10 + 10 F/16 V 0.1 F B 1 2 47 3 4 NC 5 NC 6 7 8 4.7 9 10 11 NC NC NC NC NC NC GND 16 15 14 13 12 4.7 10 VOUT GND + +12 V
PD3794
SEL1 NC SEL2 VOD 22 21 20 19 47 47
0.1 F 47 F/25 V SEL1
RB
RB
SEL2
+5 V 18 17
+ 0.1 F 10 F/16 V
2
10
2 TG3
GND
1 TG1 TG2
1 TG
10
Remark
Inverters: 74HC04
B EQUIVALENT CIRCUIT 12 V + 100 CCD VOUT 100 2SC945 47 F/25 V
2 k
15
PD3794
PACKAGE DRAWING
CCD LINEAR IMAGE SENSOR 22PIN PLASTIC DIP (400 mil)
(Unit : mm)
1st valid pixel 3.950.3 3
37.5 44.00.3 10.16
9.250.3
2.0
(1.99)
2.350.2 1 1.020.15 0.460.1 25.4 2.54 (5.42) 4.210.5 4.390.4
0~10
0.25 0.05
Name Plastic cap
Dimensions 42.9 x 8.35 x 0.7 2
Refractive index 1.5
1 The bottom of the package
The surface of the chip
2 The thickness of the cap over the chip 3 The 1st valid pixel The center of the pin 1.
22C-1CCD-PKG10-1
16
PD3794
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E). Type of Through-hole Device
PD3794CY: CCD linear image sensor 22-pin plastic DIP (400 mil)
Process Partial heating method Conditions Pin temperature: 260 C or below, Heat Time: 10 seconds or less (per pin)
Caution
During assembly care should be taken to prevent solder or flux from contacting the plastic cap. The optical characteristics could be degraded by such contact.
17
PD3794
NOTES ON CLEANING THE PLASTIC CAP
1 CLEANING THE PLASTIC CAP
Care should be taken when cleaning the surface to prevent scratches. The optical characteristics of the CCD will be degraded if the cap is scratched during cleaning. We recommend cleaning the cap with a soft cloth moistened with one of the recommended solvents below. Excessive pressure should not be applied to the cap during cleaning. If the cap requires multiple cleanings it is recommended that a clean surface or cloth be used.
2 RECOMMENDED SOLVENTS
The following are the recommended solvents for cleaning the CCD plastic cap. Use of solvents other than these could result in optical or physical degradation in the plastic cap. Please consult your sales office when considering an alternative solvent.
Solvents Ethyl Alcohol Methyl Alcohol Isopropyl Alcohol N-methyl Pyrrolidone
Symbol EtOH MeOH IPA NMP
18
PD3794
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be Semiconductor adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS device behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
19
PD3794
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96.5

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